

A camera enclosure case designed for 25*24mm, v1/v2 and the official camera module V3 boards (Standard, Wide, NoIR and NoIR Wide).













Aluminium alloy case with acrylic panel and copper heatsinks for effective heat dissipation, easy port access and assembly with external fan cooling.








A transparent acrylic enclosure offers open, stackable PCB protection in a 105×75×30 mm design. Perfect for benchtop prototyping with the WisBlock ecosystem.

















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