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Provides a quick and easy way to rework boards fitted with surface mount devices, even in RoHS products. It works by blowing 600 watts of heated air onto the board your are working on, melting the solder on the SMD pads in the process. It is fully temperature adjustable between 100°C and 480°C. The high flow air pump blows up to 40 litres per minute and is also adjustable. It includes four nozzle sets designed to direct hot air around the chip or device being removed from the board. These suit SOIC, CHIP, QFP, PLCC & BGA devices, however the nozzles can be used for a wide variety of SMD components. Also supplied with four SMD tweezers & IC removal tool. Features Low vibration air pump Suits leaded & lead free solder (RoHS) Quality heating element Rapid heat up Long service life Includes 4 nozzles, SMD tweezer set, chip removal tool & spare heating element Individual temperature & air flow adjustments Auto fan cooling extends tip life ESD safe Energy authority approved Learn More