NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. NC254 has shown to reduce or eliminate voiding under micro-BGAs. NC254 also offers high humidity tolerance and a chemistry developed for use in air reflow. Slump and humidity tolerances found in NC254 extend the solder pastes useable life in facilities where environmental control is not at its optimum. 15g Syringe Features Broad Printing Process Window Reduces Voiding under Micro-BGAs 24 Hour Stencil Life Clear Pin-Probe Testable Residue 12-14 Hour Tack Time Excellent Wetting

Does your prototyping project require soldering? Are you looking for something other than your usual run-o'-the-mill solder wire? Look no further! This high quality...

This is 50g of high quality, Lead-Free Solder Paste, the perfect amount to keep around for prototyping and hobby projects that require a bit of SMD soldering. Solder Paste Stenciling is the easiest and quickest way to solder some of the trickier SMD components. Here at SparkFun, we use solder paste stenciling on pretty much all of our boards. It saves us a lot of time. But stenciling takes more than just a stencil and a dream… you’re going to need some paste.