The Solder Vacuum, a great (and sometimes under appreciated) little tool for solder rework. It allows you to pull the molten solder out of a connection or via with ease. To use it you simply depress the plunger, heat up your solder, place the nozzle over the solder you want to remove and finally just push the button. The piston pops up and the solder disappears!
This carrier for ST’s LPS331AP digital barometer measures pressures from 260 mbar to 1260 mbar (26 kPa to 126 kPa) with absolute pressure accuracy over temperature down to ±2 mbar (0.2 kPa) and typical RMS noise of 0.02 mbar (0.002 kPa) in high-resolution mode. These pressures can easily be converted to altitudes. The board has a 3.3 V linear regulator and integrated level shifters that allow it to work over an input voltage range of 2.5 V to 5.5 V, and the 0.1″ pin spacing makes it easy to use with standard solderless breadboards and 0.1″ perfboards. The sensor offers I²C and SPI interfaces.
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