# Steinel Glue Sticks Low Melt 11mm Pk 20

**Type:** Product page · **SKU:** CE07083 · **Brand:** [Core Electronics](https://core-electronics.com.au/brands/core-electronics-australia)
**Page:** https://core-electronics.com.au/steinel-glue-sticks-low-melt-11mm-pk-20.html ([markdown](https://core-electronics.com.au/steinel-glue-sticks-low-melt-11mm-pk-20.html.md))

Its low melting temperature makes the Low-Melt adhesive particularly suitable for heat-sensitive materials, such as PU foam and polystyrene.

## Pricing

- **Price:** $65.10 (inc GST) — $59.18 AUD, exc GST
- **Quantity discounts:** 6+ $56.82 (exc GST) · 12+ $55.04 (exc GST)

## Availability & dispatch

- Out of stock — the product page offers email notification when it returns.

## Description

Its low melting temperature makes the Low-Melt adhesive particularly suitable for heat-sensitive materials, such as PU foam and polystyrene. With an application temperature of only 130°C, it protects the base surface it is applied to. The material is firm after a maximum of 80 seconds, with a strong bond being provided after approx. 40 seconds. (Times and recommended adhesive are rough guides only).

**Specifications**

- Rod Diameter 11mm
- The number of rods in the package: 20
- Melt Temperature: 130°C
- Solvent-free: Yes
- Suitable for Paper, Card / cardboard boxes, Rubber, Rubber (CR), ABS, POM, Rigid PVC, PU foam, Polystyrene
- Glue reaches final strength after 12 h
- Thermally stable 5 – 50 °C
- Open time 40 s
- Setting time 80 s

## Images

- [Product image 1](https://core-electronics.com.au/media/catalog/product/s/t/steinel-glue-sticks-low-melt-11mm-pk-20_1.jpg)