# Digi XBee® 3 Low-Power LTE-M/NB-IoT, GNSS, no SIM

**Type:** Product page · **SKU:** WRL-22329 · **Brand:** [Sparkfun](https://core-electronics.com.au/brands/sparkfun-australia)
**Page:** https://core-electronics.com.au/digi-xbee-3-low-power-lte-mnb-iot-gnss-no-sim.html ([markdown](https://core-electronics.com.au/digi-xbee-3-low-power-lte-mnb-iot-gnss-no-sim.html.md))

The Digi XBee 3 global cellular module is a cutting-edge, compact module engineered for rapid integration of cellular IoT capabilities...

## Pricing

- **Price:** $159.95 (inc GST) — $145.41 AUD, exc GST
- **Quantity discounts:** 5+ $141.05 (exc GST) · 25+ $138.14 (exc GST) · 100+ $132.32 (exc GST)

## Availability & dispatch

- Available with a lead time — expect dispatch between Aug 31 and Sep 07.

## Description

The Digi XBee 3 global cellular module is a cutting-edge, compact module engineered for rapid integration of cellular IoT capabilities. This innovative solution is equipped with cellular and BLE connectivity with end-device carrier certifications, and is designed to create secure wireless devices featuring global connectivity and positioning capabilities. A combination of the XBee ecosystem and cellular functionality makes for a simple system for working with data over a cellular connection.

Cellular LTE-M and NB-IoT are optimized for low-power, low data applications such as asset tracking and smart sensors (under 5MB of data per month). Global connectivity is immediately available with the XBee 3 global cellular. It features an excellent power saving mode to extend battery life and deployment time. It does not come with a SIM card or data plan, but Sparkfun have options available. Check out the related products section.

To augment cellular IoT development, the XBee 3 package comes complete with an array of MicroPython programming resources, the intuitive XBee Studio tool suite, and a 12-month subscription to the Digi Remote Manager® for each module, enabling remote software updates and monitoring. The Digi XBee Studio, a powerful tool designed to accelerate development, production, and deployment, further enhances cellular IoT implementation.

### Features

- Hardware
    
    
    - Cellular Chipset: Telit ME310G1-WW
    - Form factor (connector footprint): Digi XBee® 20-pin through-hole
    - Antenna options: 1 U.FL cellular, 1 U.FL Bluetooth®, 1 U.FL GNSS
    - Dimensions: 24.38 mm x 32.94 mm (0.96 in x 1.3 in)
    - Operating temperature: -40 ºC to 85 ºC (-40 ºF to 185 ºF)
    - SIM size: 4FF Nano
- Interface and I/O
    
    
    - Data interface: UART, SPI, USB
    - Operating modes (LTE-M): Transparent and API over serial, PPP over USB
    - Operating modes (NB-IoT): Transparent, API, UDP
    - Security: Digi TrustFence® security with secure boot and protected JTAG
    - Configuration tools: Digi XBee Studio® (local), Digi Remote Manager® (OTA)
    - Embedded programmability: MicroPython with 1024 kB flash / 64 kB RAM
    - I/O: 4 ADC lines (10-bit), 13 digital I/O, USB, I2C
    - Bluetooth: Bluetooth Low Energy (BLE)
- Cellular characteristics
    
    
    - Transmit power: Up to 23 dBm (LTE-M/NB-IoT), up to 33 dBm (2G)
    - Receive sensitivity (LTE-M): -105 dBm
    - Receive sensitivity (NB-IoT): -113 dBm
    - Supported bands: LTE Bands B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B71, B85; 2G Bands B2, B3, B5, B8
    - Downlink / uplink speeds (LTE-M): Up to 588 kbps downilnk, up to 1 Mbps uplink
    - Downlink / uplink speeds (NB-IoT): Up to 120 kbps downlink, up to 160 kbps uplink
    - Downlink / uplink speeds (2G): Up to 264 kbps downlink, up to 210 kbps uplink
    - Duplex mode: Half-duplex
- Power requirements (at 3.3 VDC input power)
    
    
    - Supply voltage: 3.3 – 4.3 VDC
    - Peak transmit current: 550 mA with Bluetooth disabled; 610 mA with Bluetooth enabled
    - Avg transmit current (LTE-M): 1.25 A peak, 410 mA average (GM2 modules)
    - Avg transmit current (NB-IoT): 1.3 A peak, 410 mA average (GM2 modules)
    - Avg transmit current (2G): 2.1 A peak, 320 mA average (GM2 modules)
    - Idle: 200 mA peak, 100 mA average
    - Power save mode: 20 µA
    - Deep sleep: 2.65 µA
- Regulatory and carrier approvals\*
    
    
    - FCC (USA): MCQ-XB3M2
    - ISED (Canada): 1846A-XB3M2
    - CE / RED (Europe): Complete
    - UKCA (United Kingdom): Complete
    - Japan: Pending
    - Brazil: Pending
    - Mexico (NOM): Pending
    - PTCRB, AT&T and Verizon: Complete

### Documents

- [Datasheet](https://core-electronics.com.au/attachments/localcontent/digi-xbee-3-global-lte-m-nb-iot-datasheet_14281d985c8.pdf)

## Images

- [Product image 1](https://core-electronics.com.au/media/catalog/product/W/R/WRL-22329-1.jpg)